News
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Reflow Oven Chamber Cleaning Method
After a period of use, the reflow oven chamber contains a large amount of rosin flux residue on the inner wall of the reflow chamber and the cooling zone pipes, which will reduce the heat temperature of the reflow soldering and lead to poor soldering quality. Therefore, the reflow oven chamber ne...Read more -
SMT Welding Method and Related Notes
Welding is SMT chip processing process is indispensable link, if in this a link presented mistakes will directly affect the chip processing circuit board failed and even scrapped, so in the welding need to grasp the correct welding method, understand the relevant matters of attention to avoid pro...Read more -
4 Types of SMT Rework Equipment
SMT rework stations can be divided into 4 types according to their construction, application and complexity: simple type, complex type, infrared type and infrared hot air type. 1. Simple type: this kind of rework equipment is more common than independent soldering iron tool function, can choose t...Read more -
How to prevent the placement machine human error material?
SMT machine needs to use a lot of electronic materials, electronic materials are generally loaded with trays or reels. When the production line began mass production, the need for material, when the material is almost finished, it is necessary to receive material, when the batch of PCBA board pro...Read more -
SMT machine mark point identification bad and those factors related?
SMT machine to mount electronic components to PCB designated pads, the preliminary need according to the bom table and Gerber file to write the SMD program instructions, SMD program editing into the computer control system of pick and place machine, and then SMT machine will pick up the correspon...Read more -
What Causes SMT Machine Inductor Failure?
Inductive failure is a fault that we often encounter in the process of automatic mounter placement production, many times due to SMT machine inductive failure reduces the effect and rate of our placement. Then we should how to solve this fault? Usually, cause inductor failure is usually composed ...Read more -
6 Tips for PCB Design to Avoid Electromagnetic Problems
In PCB design, electromagnetic compatibility (EMC) and the associated electromagnetic interference (EMI) have traditionally been two major headaches for engineers, especially in today’s circuit board designs and component packages continue to shrink, OEMs require higher speed systems. In th...Read more -
What Are The PCBA Cleanliness Inspection Methods?
Visual inspection method Using a magnifying glass (X5) or an optical microscope to PCBA, the quality of cleaning is assessed by observing the presence of solid residues of solder, dross and tin beads, unfixed metal particles and other contaminants. It is usually required that the PCBA surface mus...Read more -
What Causes The Poor Suction of The SMT Machine?
We often encounter poorer and poorer suction capacity of the SMT machine in the process of using SMT machine for production and processing, sometimes even the suction is crooked, so what causes this situation? Many people think it is the quality of pick and place machine, in fact, it is not. The ...Read more -
What Are The Requirements for PCB Board Press-fit Structure Design?
Multilayer PCB is mainly composed of copper foil, semi-cured sheet, core board. There are two types of press-fit structure, namely copper foil and core board press-fit structure and core board and core board press-fit structure. Preferred copper foil and core lamination structure, special plates ...Read more -
The Temperature and Humidity of PCB Board Storage and How to Store It?
with the development of electronic technology, circuit boards are widely used in various fields, almost all electronic devices have circuit boards. High-end automotive, aviation, medical electronics, common smart home, communication electronics, household appliances, etc. pcb board as a carrier o...Read more -
PCBA Thermal Pads Design Requirements
1. What is thermal pad The so-called thermal pads, refers to the bottom of the components with the metal side of the heat dissipation solder pads, usually relatively small power, mainly through the heat dissipation pads on the heat dissipation holes to the ground layer. In order to better heat di...Read more
