The production process of wave soldering machine is a very key link in all the stages of PCBA production and manufacturing. If this step is not done well, all the previous efforts are in vain. And need to spend a lot of energy to repair, so how to control the wave soldering process?
1. Check the PCB to be welded (the PCB has been coated with patch adhesive, SMC/SMD patch adhesive curing and completed the THC inserting process) attached to the parts of the component jack welding surface and gold finger are coated with solder resistance or pasted with high temperature resistant tape, in case the jack after wave soldering machine is blocked by solder. If there are larger grooves and holes, the high temperature resistant tape should be applied to prevent solder from flowing to the upper surface of PCB during wave soldering. (Water-soluble flux should be liquid flux resistance. After coating, it should be placed for 30min or baked under the drying lamp for 15min before inserting the components. After welding, it can be washed directly with water.)
2. Use a density meter to measure the density of flux, if the density is too large, dilute with thinner.
3. If the traditional foaming flux is used, pour the flux into the flux tank.
NeoDen ND200 wave soldering machine
Wave: Double Wave
PCB Width: Max250mm
Tin tank capacity: 180-200KG
Preheating: 450mm
Wave Height: 12mm
PCB Conveyor Height (mm): 750±20mm
Operation Power: 2KW
Control Method: Touch Screen
Machine size: 1400*1200*1500mm
Packing size: 2200*1200*1600mm
Transfer speed: 0-1.2m/min
Preheating Zones: Room temperature-180℃
Heating Method: Hot Wind
Cooling Zone: 1
Cooling method: Axial fan
Solder temperature: Room Temperature—300℃
Transfer Direction: Left→Right
Temperature Control: PID+SSR
Machine Control: Mitsubishi PLC+ Touch Screen
Weight: 350KG
Post time: Nov-05-2021