Introduction
Solder reflow oven is an indispensable part of SMT. It melts and reflows the solder paste through high temperature, thus forming a high-quality solder joint on the PCB and ensuring stable connection of electronic components. Specifically, solder reflow oven is the soldering of components to PCB boards for surface mount devices. It achieves the purpose of soldering SMDs (surface mount devices) by relying on the action of hot airflow on the solder joints, so that the gelatinous flux reacts physically under a certain high temperature airflow.
Welding yield not only directly affects the economic benefits of enterprises, but also plays an important role in improving product quality and customer satisfaction, enhance market competitiveness. The reflow soldering oven selection is the basis for improving the yield of electronic manufacturing, directly related to product quality and production efficiency. Enterprises should pay attention to the selection of equipment to ensure that it meets the welding requirements of their products, so as to take advantage of the fierce competition in the market.
I. The SMT reflow oven overview
1. Basic working principle
SMT Reflow oven is the use of reflow furnace on the surface mount electronic components for heating, so that components and PCBs on the solder paste melting flow, to achieve the components and printed circuit boards between the welding.
2. Comparison of different types of reflow oven
2.1 Infrared / hot air reflow oven
In the infrared furnace based on the addition of hot air to make the furnace temperature more uniform, is currently the more ideal heating method. This type of equipment to take full advantage of the infrared penetrating power of the characteristics of high thermal efficiency, power saving, while effectively overcoming the infrared reflow oven of the local temperature difference and masking effect, and make up for the hot air reflow oven on the gas flow rate requirements of the impact of too fast.
2.2 Far infrared reflow soldering
Far infrared reflow soldering used in the 1980s with fast heating, energy saving, smooth operation and other characteristics, but due to the printed circuit board and a variety of components of different materials, color and radiation heat absorption rate has a large difference, resulting in a variety of different components on the circuit as well as different parts of the temperature is not uniform, i.e., the local temperature difference. In addition, the thermal radiation on the printed circuit board is blocked parts, such as in the large (high) component shadow parts of the welding pins or small components will be due to insufficient heating and resulting in poor welding.
2.3 Full hot air reflow oven
Full hot air reflow oven is a kind of convection jet nozzle or heat-resistant fan to force the airflow circulation, so as to realize the soldered parts of the welding method of heating. Because of this heating method, PCB and components of the temperature close to the given heating temperature zone gas temperature, completely overcome the infrared reflow soldering of the local temperature difference and masking effect, so it is currently more widely used.
II. The core parameters of the overview
The core parameters of reflow oven including temperature profile, atmosphere environment, air supply system, programmability and flexibility, equipment stability and reliability.
The above core parameters in the PBC reflow oven furnace selection process affects each other and jointly determine the welding quality and productivity. Through the reasonable selection and optimization of these parameters, enterprises can significantly improve product yields and production capacity, so as to gain a competitive advantage in the market.
III. The detailed analysis of the core parameters
1. Temperature profile
- Influencing factors: The temperature profile determines the heating, holding and cooling time during the welding process.
- Welding quality: The proper temperature profile ensures that the solder is fully melted and cooled at the optimal temperature, reducing the occurrence of defects such as cold welding and false welding.
- Productivity: Proper temperature control reduces rework of nonconforming products and improves the overall output of the SMD production line.
2. Atmospheric environment
- Influencing factors: the atmosphere in the reflow oven (air, nitrogen or vacuum) will directly affect the welding process.
- Solder Quality: Selecting the proper atmosphere reduces oxidation, improves the quality and reliability of solder joints, and ensures optimal performance of the solder.
- Productivity: An optimized atmosphere environment reduces downtime due to welding defects and ensures continuous production.
3. Air supply method
- Influencing factors: The design of the air supply system determines the distribution of heat and the uniformity of air flow.
- Soldering quality: Uniform air supply can ensure that the temperature is evenly distributed across the PCB to avoid localized overheating or overcooling, thus improving soldering consistency.
- Productivity: Optimized air supply system reduces temperature fluctuations, providing a more stable soldering environment and reducing production interruptions due to equipment failure.
4. Programmability and Flexibility
- Influencing factors: The programmability of the equipment affects the efficiency of adjusting welding parameters.
- Welding Quality: Flexible programmability allows the user to quickly adapt to different welding needs and material types, thus improving weld quality.
- Production efficiency: The equipment’s rapid adjustment ability to shorten the line change time, improve the responsiveness of the production line, especially suitable for small batch multi-species production.
IV. The summary and recommendations
When choosing reflow oven, it is crucial to refer to the core parameters of the equipment, which will directly affect the welding quality and production efficiency. By optimizing the temperature profile, selecting the appropriate atmosphere, designing an efficient air supply system, ensuring the flexibility and programmability of the equipment, as well as evaluating the stability and reliability of the equipment, companies can significantly improve soldering yields and reduce production costs.
Key considerations when selecting reflow oven:
- Comprehensive needs assessment: Prior to selection, thoroughly analyze production needs, including product type, batch size and soldering process requirements, to ensure that the selected equipment meets the specific production task.
- Technical compatibility: Ensure the compatibility of the selected reflow oven with the current production line to avoid unnecessary technical problems in subsequent integration.
- Ease of operation: Select equipment that is easy to operate and maintain to reduce training costs and improve operational efficiency.
- Supplier support: choose reliable equipment suppliers to ensure access to good technical support and after-sales service to solve production problems in a timely manner.
Through a comprehensive understanding of the core parameters and scientific selection, companies will achieve higher product quality and productivity in the reflow soldering process, ultimately promoting business growth and success.
Company Profile
Zhejiang NeoDen Technology Co., Ltd. has been manufacturing and exporting various small pick and place machines since 2010. Taking advantage of our own rich experienced R&D, well trained production, NeoDen wins great reputation from the world wide customers.
In our global Ecosystem, we collaborate with our best partners to deliver a more closing sales service, high professional and efficient technical support.
We believe that great people and partners make NeoDen a great company and that our commitment to Innovation, Diversity and Sustainability ensures that SMT automation is accessible to every hobbyist everywhere.
Post time: Apr-29-2025