Introduction
In the context of rapid advancements in electronic information technology, high-frequency circuit boards are widely used in fields such as 5G communication, radar systems, and high-speed interconnect devices. Compared to traditional circuit boards, high-frequency boards impose stricter requirements on signal integrity, impedance control, and electromagnetic compatibility. For PCBA manufacturing companies, testing high-frequency boards is not only more complex but also presents new challenges in terms of testing strategies, equipment capabilities, and personnel qualifications.
I. Challenges posed by high-frequency characteristics to testing
The core characteristics of high-frequency circuits are high signal frequency and fast transmission rates, making their electrical performance highly susceptible to even minor process errors. In traditional PCBA manufacturing, standard testing methods such as ICT and FCT struggle to accurately identify signal integrity issues in high-frequency boards. For example, minor deviations in trace width or improper via processing can lead to impedance discontinuities or signal reflections, issues that are not prominent in low-frequency products. Additionally, high-frequency signals are more susceptible to electromagnetic interference, necessitating more rigorous design and layout of the testing environment.
II. Higher Requirements for Test Equipment and Fixture Compatibility
High-frequency PCBA testing imposes strict requirements on the structure and materials of test fixtures and probes. Traditional probes, due to their parasitic inductance and capacitance, may cause signal distortion at high frequencies. Therefore, high-performance coaxial probes or microwave-grade interfaces should be selected, and signal paths should be optimized within test fixtures to minimize signal propagation distances. Additionally, the test platform must have sufficient bandwidth and low-noise performance to avoid introducing interference that could affect the accuracy of test results.
III. Specialized Test Items Are Essential
Compared to conventional board testing, high-frequency PCBA products require more detailed test item configurations. In addition to basic power supply and electrical connection tests, specialized projects such as impedance testing, time-domain reflectometry (TDR), and signal integrity analysis should be included. These tests can help confirm the continuity and transmission quality of signal paths and identify structural defects that may cause high-speed signal distortion in advance. During the FCT stage, high-speed signal operating conditions should also be simulated to verify the system’s response capability under high loads.
IV. High-frequency PCB material properties must be considered in testing
High-frequency circuit boards often use specialized high-frequency materials such as PTFE and PPE, which have significantly different processing properties compared to standard FR4. For example, these materials have lower moisture absorption and different thermal expansion coefficients, resulting in a narrower soldering process window. During testing, attention should be paid to issues such as cold solder joints and cold soldering caused by material properties, particularly around small BGA components and high-speed connectors. Additionally, the impact of soldering on high-frequency transmission performance should be verified to ensure that the assembly process does not adversely affect electrical performance.
V. Testing and design should be coordinated in advance
To enhance the effectiveness of high-frequency PCBA testing, testing strategies should not be implemented solely as a remedial measure at the final product stage but should be integrated into the product design phase. When planning the layout, the design team should consider the rationality of test point layout, compatibility of test fixture interfaces, and other factors to lay the groundwork for efficient testing. Especially in PCBA projects operating in the microwave frequency band, improper test point layout may directly result in inability to test or excessive test errors, impacting overall delivery schedules.
Conclusion
The rise of high-frequency circuit boards has driven technological upgrades and capability expansion in the PCBA manufacturing industry. In this process, testing, as a critical quality assurance process, has become increasingly important. Only by deeply understanding the testing challenges posed by high-frequency characteristics, configuring appropriate equipment, developing customized solutions, and promoting the collaborative development of design and testing can PCBA manufacturing companies establish a firm foothold in the high-frequency era and achieve higher levels of product delivery and customer satisfaction.
Company Profile
Zhejiang NeoDen Technology Co., Ltd. has been manufacturing and exporting various small pick and place machines since 2010. Taking advantage of our own rich experienced R&D, well trained production, NeoDen wins great reputation from the world wide customers.
with global presence in over 130 countries, the excellent performance, high accuracy and reliability of NeoDen PNP machines make them perfect for R&D, professional prototyping and small to medium batch production. We provide professional solution of one stop SMT equipment.
Post time: Jul-10-2025