What are the laws for setting the reflow oven temperature profile?

General reflow oven furnace operator interface shows the temperature is the furnace built in a thermocouple probe at the temperature, it is neither the temperature on the PCB, nor because the surface of the heat generator or resistance wire temperature, in fact, is the temperature of the hot air. To set the oven temperature, you must understand the following two basic laws of heat transfer. The following share the laws of setting the reflow oven temperature curve.

1. At a given point within the reflow oven test, if the PCB temperature is significantly lower than the control oven temperature, then the PCB will warm up. If the PCB temperature level is higher than the overall oven temperature, then the PCB temperature will drop. If the PCB temperature and furnace temperature to reach equal, there will be no heat to exchange.

2. The larger the difference between the reflow oven temperature and the PCB temperature, the faster the PCB temperature changes.

Reflow soldering furnace temperature settings, generally should first determine a furnace chain transfer information speed, and then start the working temperature setting. Chain speed is slow, the furnace temperature can be lower, because a longer time can also reach thermal equilibrium. Conversely, the reflow furnace temperature can be increased.

If the PCB components on the dense, large components, to achieve thermal equilibrium, more heat is required, which requires higher reflow oven temperature. On the contrary, it is required to reduce the reflow oven temperature. It should be emphasized that the chain speed range is generally not large, because the total length of the reflow oven’s soldering process time and temperature zone is determined, unless the reflow oven’s temperature zone is relatively large and long, the production capacity is quite sufficient.

ND2+N8+IN12C

Brief Introduction of NeoDen IN12C Reflow Oven

NeoDen IN12C is a new environmentally friendly, stable performance intelligent automatic orbital reflow soldering. This reflow solder adopts the exclusive patented design of “even temperature heating plate” design, with excellent soldering performance; with 12 temperature zones compact design, lightweight and compact; to achieve intelligent temperature control, with high-sensitivity temperature sensor, with stable temperature in the furnace, the characteristics of small horizontal temperature difference; while using Japan NSK hot air motor bearings and Switzerland imported Heating wire, durable and stable performance. And through the CE certification, to provide authoritative quality assurance.


Post time: Dec-26-2023

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