Method for Quality Inspection of PCB

1. X – ray pick up check

After the circuit board is assembled, X-ray machine can be used to see the BGA underbelly hidden solder joints bridging, open, solder deficiency, solder excess, ball drop, loss of the surface, popcorn, and most often holes.

NeoDen X Ray Machine

X-Ray Tube Source Specification

Type Sealed Micro-Focus X-Ray Tube

voltage Range: 40-90KV

current Range: 10-200 μA

Max Output Power: 8 W

Micro Focus Spot Size: 15μm

Flat Panel Detector Specification

Type TFT Industrial Dynamic FPD

Pixel Matrix: 768×768

Field of View: 65mm×65mm

Resolution: 5.8Lp/mm

Frame:(1×1) 40fps

A/D Conversion Bit: 16bits

Dimensions: L850mm×W1000mm×H1700mm

Input Power: 220V  10A/110V  15A  50-60HZ

Max Sample Size: 280mm×320mm

Control System Industrial: PC WIN7/ WIN10 64bits

Net Weight About: 750KG

2. Scanning ultrasonic microscopy

Completed assembly plates can be inspected for various internal concealment by SAM scanning. Packaging systems can be used to detect various internal cavities and layers. This SAM method can be divided into three scanning imaging methods: A < point-shaped), B < linear) and C < planar), and C-SAM planar scanning is most commonly used.

3. Screwdriver strength measurement method

The torsional moment of the special driver is used to lift and tear the solder joint to observe its strength. This method can find defects such as floating, interface splitting, or welding body cracking, but it is not good for thin plate.

4. Microslice

This method not only requires various facilities for sample preparation, but also requires sophisticated skills and rich interpretation knowledge to get to the bottom of the real problem in a destructive way.

5. Infiltration dyeing method (commonly known as red ink method)

The sample is immersed in a special diluted red dye solution, so the cracks and holes of various solder joints are capillary infiltration, and then it is baked dry. When the test ball foot is forcibly pulled or pry open, you can check whether there is erythema on the section, and see how the integrity of the solder joint? This method, also known as Dye and Pry, can also be formulated with fluorescent dyes to make it easier to see the truth in ultraviolet light.

K1830 SMT production line


Post time: Dec-07-2021

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