PCBA board use process, there will often be the phenomenon of pad off, especially in the PCBA board repair time, when using a soldering iron, it is very easy to line pad off the phenomenon, PCB factory should be how to deal with? In this paper, the reasons for the pad off some analysis.
1. Plate quality problems
Due to the copper-clad laminate plate copper foil and epoxy resin between the resin adhesive bonding adhesion is relatively poor, that is, even if a large area of copper foil of the circuit board copper foil slightly heated or under mechanical force, it is very easy to separate from the epoxy resin resulting in pads off or copper foil off and other issues.
2. The impact of the circuit board storage conditions
Affected by the weather or long time storage in a humid place, PCB board moisture absorption leads to too much moisture, in order to achieve the desired welding effect, patch welding to compensate for the heat taken away due to moisture evaporation, welding temperature and time should be extended, such welding conditions are prone to cause the circuit board copper foil and epoxy resin delamination, so the PCB processing plant should pay attention to the humidity of the environment when storing the PCB board.
3. Soldering iron welding problems
General PCB board adhesion can meet the ordinary welding, there will be no pad off phenomenon, but electronic products are generally possible to repair, repair is generally used soldering iron welding repair, due to the local high temperature of the soldering iron often reaches 300-400 ℃, resulting in a local instantaneous high temperature of the pad, the welding of the resin below the copper foil by the high temperature fall off, the appearance of the pad off. Soldering iron dismantling is also easy to incidental soldering iron head on the physical force of the welding disc, which also leads to the cause of the pad off.
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Post time: Jul-11-2023