Reflow soldering machine has a good process, there is no special requirements for the layout of components location, direction and spacing. Reflow soldering surface components layout mainly consider solder paste printing stencil open window to components spacing requirements, check and return to repair space requirements, process reliability requirements.
1.Surface mount components forbidden cloth area.
Transmission side (parallel to the transmission direction), distance from the side 5mm range is forbidden cloth area. 5mm is a range that all SMT equipment can accept.
Non-transportation side (the side which is perpendicular to the direction of transport), 2~5mm range from the side is forbidden area. Theoretically, components can be laid out to the edge, but due to the edge effect of stencil deformation, a no-layout zone of 2~5mm or more must be established to ensure that the solder paste thickness meets the requirements.
The transmission side of the no-layout area can not be laid out any kind of components and their pads. Non-transmission side of the no-layout area mainly prohibits the layout of surface mount components, but if you need to layout cartridge components, should be considered to prevent wave soldering upward flip tin tooling process requirements.
2.Components should be as regular as possible to arrange. Polarity of the components of the positive pole, IC gap, etc. uniformly placed towards the top, towards the left, regular arrangement is convenient for inspection, and help to improve the speed of patching.
3.Components as evenly laid out as possible. Uniform distribution is conducive to reducing the temperature difference on the board when reflow soldering, especially the large size BGA, QFP, PLCC centralized layout, will cause PCB local low temperature.
4.The spacing between components (interval) is mainly related to the requirements of assembly and welding operations, inspection, rework space, etc., can generally refer to industry standards. For special needs, such as mounting space for heat sink and operating space for connectors, please design according to actual needs.
Features of NeoDen IN12C
1.The control system has the characteristics of high integration, timely response, low failure rate, easy maintenance, etc.
2.Unique heating module design, with high precision temperature control, uniform temperature distribution in the thermal compensation area, high efficiency of thermal compensation, low power consumption and other characteristics.
3.Can store 40 working files.
4.Up to 4-way real-time display of PCB board surface welding temperature curve.
5.lightweight, miniaturization, professional industrial design, flexible application scenarios, more humane.
6.Energy saving, low power consumption, low power supply requirements, ordinary civilian electricity can meet the use, compared to similar products a year can save electricity costs and then buy 1 unit of this product.
Post time: Aug-03-2022