Sequence of SMT and DIP

PCBA manufacturing and processing industry has two terminology terms: SMT and DIP. The general industry also called these two sections for the front and back, SMT mount in the front, DIP in the back, why the manufacturing process to be so divided?

Follow the “first small, then large, first low, then high”

In the electronic SMT processing and manufacturing industry, follow the principle of first small and then large, first low and then high. The reason is that electronic materials have different sizes, an SMT line body is generally 1 (high speed pick and place machine) + 1 (multifunctional pick and place machine) or 2 (high speed SMT machine) + 1 (multifunctional SMT machine) mode. High speed machine usually paste loading small material, multi-functional spent machine paste loading big material, the reason is if first paste big material, one is slow, lead to high-speed machine waste efficiency, two, if first paste big material, it will lead to mount head subsequent mobile mount produce height obstacle, reduce efficiency.

Also with the development of the component technology, the size is getting smaller and smaller, need DIP material is also getting less and less, so DIP placed in the back section is also justifiable, because most of the components can be reflowed through the SMD reflow oven.

In the PCB design, we should pay attention to the high SMD components pin pads and direct plug-in components as far as possible to design, which is conducive to the plug-in components wave soldering machine.

NeoDen YY1 pick and place machine features

1.Automatic nozzle changer help realizing nozzles changed flexibly.
2.Independent high-definition & high-speed dual vision recognition systems,as well as dual cameras for real-time display the working status.
3.Small size with powerful magazines and newly designed tape feeders to support large tape reels configuration flexibly,easy to install and replace tape reels conveniently,to ensure the most excellence solution among all of the entry level machines with lower budget but higher stability.
4.The newly-designed stick feeder with its compact shape, is perfectly compatible with the tape feeder system.
5.Supports bulk component feeder,strip feeder and IC tray feeder.
6.Newly designed software system & UI for visual programming and placement, which allows fast programming on the machine, friendly interface & easy operation.

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Post time: Jul-13-2022

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