The difference between laser welding and selective wave soldering

As all kinds of electronic products are beginning to be miniaturized, the application of traditional welding technology to various new electronic components has certain tests. In order to cater to such market demand, among the welding process technology, it can be said that the technology is continuously improved, and the welding methods are also more diversified. This article selects the traditional welding method selective wave welding and the innovative laser welding method to compare, you can see the convenience brought by technological innovation more clearly.

Introduction to selective wave soldering

The most obvious difference between selective wave soldering and traditional wave soldering is that in traditional wave soldering, the lower part of the PCB is completely immersed in liquid solder, while in selective wave soldering, only some specific areas are in contact with the solder. During the soldering process, the position of the solder head is fixed, and the manipulator drives the PCB to move in all directions. The flux must also be pre-coated before soldering. Compared with wave soldering, the flux is only applied to the lower part of the PCB to be soldered, rather than the entire PCB.

Selective wave soldering uses a mode of applying flux first, then preheating the circuit board/activating flux, and then using a solder nozzle for soldering. The traditional manual soldering iron requires point-to-point welding for each point of the circuit board, so there are many welding operators. Wave soldering adopts a pipelined industrialized mass production mode. Welding nozzles of different sizes can be used for batch soldering. Generally, the soldering efficiency can be increased by several tens of times compared with manual soldering (depending on the specific circuit board design). Due to the use of a programmable movable small tin tank and various flexible welding nozzles (the tin tank capacity is about 11 kg), it is possible to avoid certain fixed screws and reinforcements under the circuit board by programming during welding Ribs and other parts, so as to avoid damage caused by contact with high-temperature solder. This kind of welding mode does not need to use custom welding pallets and other methods, which is very suitable for multi-variety, small-batch production methods.

Selective wave soldering has the following obvious characteristics:

  •  Universal welding carrier
  • Nitrogen closed loop control
  •  FTP (File Transfer Protocol) network connection
  • Optional dual station nozzle
  • Flux
  • Warm up
  • Co-design of three welding modules (preheating module, welding module, circuit board transfer module)
  •  Flux spraying
  •  Wave height with calibration tool
  • GERBER (data input) file import
  •  Can be edited offline

In the soldering of through-hole component circuit boards, selective wave soldering has the following advantages:

  •  High production efficiency in welding, can achieve a higher degree of automatic welding
  •  Precise control of flux injection position and injection volume, microwave peak height, and welding position
  •  Able to protect the surface of microwave peaks with nitrogen; optimize the process parameters for each solder joint
  •  Quick change of nozzles of different sizes
  • A combination of fixed-point soldering of a single solder joint and sequential soldering of through-hole connector pins
  •  The degree of “fat” and “thin” solder joint shape can be set according to requirements
  •  Optional multiple preheating modules (infrared, hot air) and preheating modules added above the board
  •  Maintenance-free solenoid pump
  •  The selection of structural materials is completely suitable for the application of lead-free solder
  •  Modular structure design reduces maintenance time

Post time: Aug-25-2020

Send your message to us: