I. BGA packaged is the packaging process with the highest welding requirements in PCB manufacturing. Its advantages are as follows:
1. Short pin, low assembly height, small parasitic inductance and capacitance, excellent electrical performance.
2. Very high integration, many pins, large pin spacing, good pin coplanar. The limit of the pin spacing of the QFP electrode is 0.3mm. When assembling the welded circuit board, the mounting accuracy of the QFP chip is very strict. The reliability of the electrical connection requires the mounting tolerance to be 0.08mm. QFP electrode pins with narrow spacing are thin and fragile, easy to twist or break, which requires that the parallelism and planarity between the circuit board pins must be guaranteed. In contrast, the biggest advantage of BGA package is that the 10-electrode pin spacing is large, typical spacing is 1.0mm.1.27mm,1.5mm (Inch 40mil, 50mil, 60mil), the mounting tolerance is 0.3mm, with ordinary multi-functional SMT machine and reflow oven can basically meet the requirements of BGA assembly.
II. While BGA encapsulation has the above advantages, it also has the following problems. The following are the disadvantages of BGA encapsulation:
1. It is difficult to inspect and maintain BGA after welding. PCB manufacturers must use X-ray fluoroscopy or X-ray layering inspection to ensure the reliability of the circuit board welding connection, and the equipment costs are high.
2. Individual solder joints of the circuit board are broken, so the whole component must be removed, and the removed BGA cannot be reused.
Post time: Jul-20-2021