SMT pick and place machine refers to the abbreviation of a series of technological processes on the basis of PCB. PCB means a Printed Circuit Board.
Surface Mounted Technology is the most popular Technology and process in the electronic assembly industry at present. Printed Circuit Board is a Circuit assembly technology in which surface assembly components without pins or short leads are installed on the surface of Printed Circuit boards or other substrates and soldered together by means of reflow welding, dip welding, etc.
In general, the electronic products we use are made of PCB plus a variety of capacitors, resistors and other electronic components according to the design of the circuit diagram design, so all kinds of electrical appliances need a variety of different SMT processing technology to process.
SMT basic process elements: solder paste printing -> SMT mounting -> reflow oven ->AOI equipment optical inspection -> maintenance -> board.
Due to the technological process of complicated SMT processing, so there are many SMT processing factories, for SMT quality has been improved, and the SMT process, every link is crucial, cannot have any mistake, today small make up with everyone together learn SMT reflow welding machine is introduced and the key technology in processing.
Reflow soldering equipment is the key equipment in SMT assembly process. The quality of PCBA solder joint depends entirely on the performance of reflow soldering equipment and the setting of temperature curve.
The reflow welding technology has experienced the development of plate radiation heating, quartz infrared tube heating, infrared hot air heating, forced hot air heating, forced hot air heating and nitrogen protection and other forms.
Increased requirements for cooling process of reflow soldering have also promoted the development of cooling zones for reflow soldering equipment, ranging from natural cooling and air cooling at room temperature to water cooling systems designed for lead-free soldering.
Reflow soldering equipment due to the production process of temperature control accuracy, temperature uniformity in the temperature zone, transfer speed and other requirements. And developed from three temperature zone five temperature zone, six temperature zone, seven temperature zone, eight temperature zone, ten temperature zone and other different welding systems.
Key parameters of reflow soldering equipment
1. The number, length and width of the temperature zone;
2. Symmetry of upper and lower heaters;
3. Uniformity of temperature distribution in the temperature zone;
4. Independence of temperature range transmission speed control;
5, inert gas protection welding function;
6. Gradient control of cooling zone temperature drop;
7. Maximum temperature of reflow welding heater;
8. Temperature control precision of reflow soldering heater;
Post time: Jun-10-2021