1. Manual welding for the amount of solder and solder wetting angle control, welding consistency of the grasp, metallization hole over the tin rate requirements are almost all more difficult, especially when the electronic components pin is gold-plated, it is necessary to complete the tin-lead soldering position for the need to remove the gold enamel before welding, for hand welding this operation is more difficult.
2. Along with the increase in density of PCB board and circuit wrench thickness, prompting the increase in welding heat capacity, soldering iron welding is easier to make insufficient heat, resulting in false solder or through-hole solder climb height does not meet the requirements, and in order to forcibly achieve the required heat and highly increase the temperature and welding time is likely to make the PCB circuit board damage and even pad off.
3. PCBA processing wave soldering process has sufficient adjustment space to each solder joint welding conditions, such as the amount of flux spraying, welding time, welding wave height and wave height to the right, the defect rate can be significantly reduced and may even reach through-hole electronic components zero defect welding, and manual welding, through-hole reflow soldering machine and traditional wave soldering compared to the defect rate of selective wave soldering (DPM) is lowest.
4. Wave soldering machine because of the use of programmable removable small tin cylinder and a variety of flexible welding nozzle, so in the welding can be programmed to avoid some fixed PCB B-side screws and reinforcement, etc., to prevent its contact with high-temperature solder and cause damage, but also do not need to use custom welding tray and other methods.
Features of NeoDen ND200 wave soldering machine
Heating Method: Hot Wind
Cooling method: Axial fan
Transfer Direction: Left→Right
Temperature Control: PID+SSR
Machine Control: Mitsubishi PLC+ Touch Screen
Flux tank capacity: Max 5.2L
Spray Method: Step Motor+ST-6
Post time: Dec-22-2022