What Is The Problem of Pulling The Tip of The Solder Joint?

PCBA processing through rate is actually the product from the previous process to the next process between the time required to consume, then the less time, the higher the efficiency, the higher the yield rate, after all, only when your product does not have problems to flow to the next step. With this issue we talk about the generation of solder joints in PCBA welding pulling tip and the solution:

1. PCB circuit board in the preheating stage temperature is too low, preheating time is too short, so that the PCB and component device temperature is low, welding components and PCB heat absorption generated convex punch tendency.

2. SMT placement welding temperature is too low or conveyor belt speed is too fast, so that the viscosity of the molten solder is too large.

3. electromagnetic pump wave soldering machine wave height is too high or the pin is too long, so that the bottom of the pin can not contact with the wave peak. Because the electromagnetic pump wave soldering machine is hollow wave, the thickness of the hollow wave is 4~5mm.

4. Poor flux activity.

5. DIP cartridge components lead diameter and cartridge hole ratio is not correct, cartridge hole is too large, large pad heat absorption.

The above problem points are the most important factors in the generation of solder joint pulling tip, so we have to make corresponding optimization and adjustment for the above problems in smt placement processing, to solve the problem before it happens, to ensure the product yield and delivery speed.

1. Tin wave temperature of 250 ℃ ± 5 ℃, welding time 3 ~ 5s; temperature is slightly lower, the conveyor belt speed to slow down some.

2. wave height is generally controlled at 2/3 of the thickness of the printed board. Inserted component pin forming requires component pins to be exposed to the printed

3. Board soldering surface 0.8mm~3mm.

4. Replacement of flux.

5. The hole diameter of the cartridge hole is 0.15~0.4mm larger than the lead diameter (fine lead take the lower line, thick lead take the upper limit).

FP2636+YY1+IN6

Features of NeoDen IN6 Reflow Oven

1. Full convection, excellent soldering performance.

2. 6 zones design, light and compact.

3. Smart control with high sensitivity temperature sensor, the temperature can be stabilized within + 0.2℃.

4. Original built-in soldering smoke filtering system, elegant appearance and eco-friendly.

5. Heat insulation protection design, the casing temperature can be controlled within 40℃.

6. Household power supply, convenient and practical.


Post time: Jun-20-2023

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