News
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How to design hardware circuits with fewer detours?
There is a lot of experience and knowledge about hardware circuits on the Internet that is overwhelming. Like signal integrity, EMI, PS design will confuse you. Don’t be in a hurry, take your time with everything. This article is dedicated to those who are just starting or about to start d...Read more -
Why Does The Solder Paste Need to Be Tempered and Stirred?
SMT chip processing has an important supporting auxiliary materials, is the solder paste. Solder paste composition mainly contains tin powder alloy particles and flux (flux contains rosin, active agent, solvent, thickener, etc.), solder paste is similar to toothpaste, used for solder paste printi...Read more -
EFY EXPO 2023 | Pune, India Exhibition
NeoDen YY1 showed at EFY EXPO 2023 | Pune, India 24th- 25th, Mar.2023 NeoDen official Indian distributor—- CHIPMAX DESIGNS PVT LTD will take the new product- small desktop pick& place machine YY1 at the exhibition, welcome to visit us at Stall #E4. YY1 is featured with automatic nozzle ...Read more -
Which Industries Need PCBA Processing?
PCBA (printed circuit board assembly) processing technology is widely used in many industries. The following are some of the industries that require PCBA processing. 1. Consumer electronics industry. Including smart phones, tablet PCs, laptops, digital cameras, game consoles, etc. 2. Communicatio...Read more -
The Development Trend of PCBA Processing Industry
with the rapid development of global electronics manufacturing industry, PCBA processing industry will also face various opportunities and challenges in 2023. The following are the development trends of the PCBA processing industry in 2023. 1. Commercialization of 5G network. 5G network will brin...Read more -
What aspects should be paid attention to in pcba cleaning?
PCBA processing, in SMT and DIP plug-in soldering, the surface of the solder joints will be residual some flux rosin, etc.. The residue contains corrosive substances, residue in the pcba pad components above, may cause leakage, short circuit and thus affect the life of the product. The residue is...Read more -
What are the solutions to the high material throwing rate of the chip machine?
Chip machine throwing material is a bad production of the chip machine phenomenon, different brands of chip machine throwing material rate have a reasonable range, beyond a reasonable range, it is necessary to check and solve the problem of high throwing material rate. General placement machine t...Read more -
Temperature and humidity-sensitive components storage and use
Electronic components are the main materials for chip processing, some components and common different, need special storage to ensure that no problems, temperature and humidity sensitive components is one of them. Temperature and humidity sensitive components management storage in the processing...Read more -
Classification of Packaging Defects (II)
5. Delamination Delamination or poor bonding refers to the separation between the plastic sealer and its adjacent material interface. Delamination can occur in any area of a molded microelectronic device; it can also occur during the encapsulation process, post-encapsulation manufacturing phase, ...Read more -
Classification of Packaging Defects (I)
Packaging defects mainly include lead deformation, base offset, warpage, chip breakage, delamination, voids, uneven packaging, burrs, foreign particles and incomplete curing, etc. 1. Lead deformation Lead deformation usually refers to the lead displacement or deformation caused during the flow of...Read more -
Printed Circuit Board Manufacturing
There are five standard technologies used in printed circuit board manufacturing. 1. Machining: This includes drilling, punching and routing holes in the printed circuit board using standard existing machinery, as well as new technologies such as laser and water jet cutting. The strength of the b...Read more -
BGA Packaging Process Flow
Substrate or intermediate layer is a very important part of BGA package, which can be used for impedance control and for inductor/resistor/capacitor integration in addition to interconnect wiring. Therefore, the substrate material is required to have high glass transition temperature rS (about 17...Read more
