Products
Machine Rework BGA

Machine Rework BGA

● ±3°C Temperature Control Accuracy
● 5300W Total Power ( Max )
● 415×370 mm PCB Size ( Max )
NeoDen ND722R equip with advanced features such as a high-definition optical alignment system, fully automated remove remove, and PC-based intelligent control, NeoDen ND722R significantly enhances rework efficiency and yield rates, making it the ideal choice for achieving high-quality BGA rework operations.

Description of NeoDen ND722R BGA Rework Machine

  • Temperature parameters protected by limits of authority, for avoiding error settings.
  • Ten segments of temperature control process, suitable for all kinds of BGA Rework.
  • Unlimited storage of the temperature profile, just need press one key to use the profile.
  • Desoldering and soldering automatically, No need the manual adjustment.
  • Hot air flow can be adjustable to meet the demand of any chips.
  • USB Connection driver-free, PC control.
  • Laser positioning available, to make the positioning faster.
BGA Reflow Station
BGA Reflow Station
BGA Reflow Station

 

Products Description

Power: AC 220V±10% 50/60 Hz
Total Power: Max 5300W
Heater power: Bottom heater 1200 W, IR heater 2700 W Other 300W
Positioning: V-groove, PCB support
PCB size: Max 415×370 mm, Min 6×6 mm
BGA chip: Max 60×60 mm, Min 2×2 mm
IR Heater Size: 285*375mm
Alignment Accuracy: ±0.02mm
Sensors: 1 pc
Color: white

 

Our Service

1. More Professional service in PNP machine field.
2. Better manufacture ability.
3. Various payment term to choose: T/T, Western Union, L/C, Paypal.
4. High quality/Safe material/Competitive price.
5. Small order available.
6. Quickly response.
7. More safe and fast transport.

 

 

About NeoDen

 
Factory
 
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Exhibition
 
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Certification
 

NeoDen Certification

 

FAQ

Q1. Is this machine manual mode or automatic mode?

Support automatic removal, welding and mount in CCD Optical Alignment System, it is easy to operate in high accuracy even for less experienced operator.

 

Q2. What component types can the ND722R rework?

It repairs BGA/POP/CSP/LED/QFN/CSP/LGA/Micro SMD/MLF(Micro Lead Frames), and other SMD components.

 

Q3. Can I request to change the form of packaging and transportation?
Yes, We can change the form of the packaging and transportation according to your request, but you have to bear their own costs incurred during this period and the spreads.

 

Q4. What is your advantage compared with your competitors?

(1). Qualified Manufacturer

(2). Reliable Quality Control

(3). Competitive Price

(4). High Efficiency working (24*7hours)

(5). One-Stop Service

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