Highlights and Details Of neoDen YS350
1. Touch Screen Interface
Time Display Function
Automatic Counting Function of Printing Times
2. Scrapers
Similar to the full automatic printing machine, the scraper can freely move up and down.
The pressure of scarper is adjustable according to different model of scraper.
The stopping time of scraper at the position of upper left / right and lower left / right can be set independently.
The speed of the scrapers can be adjusted.
Emergency stop of the scrapers to keep the safety.
3. Stencil
Similar to full automatic printing machine, the stencil will rise slowly within 2 seconds to demould, then quickly rise to leave the PCB, which avoids the wire drawing occurring in the demould and saves time and improves production efficiency.
Products Description
PCB size (Max): 400*240mm
Printing area: 500*320mm
Frame size: L(550-650)*W(370-470)
Printing Accuracy: ±0.2mm
PCB thickness: 0.2-2.0mm
Air source: 4-6kg/căĄ
Power supply: AC220V 50HZ / AC110V 60HZ
Dimension: L800*W700*H1700 mm
Packing size: 1050 * 900 * 1850 mm
Net weight: 230kg
Gross weight: 280KG
Our Services
1. More Professional service in PNP machine field.
2. Better manufacture ability.
3. Various payment term to choose: T/T, Western Union, L/C, Paypal.
4. High quality/Safe material/Competitive price.
5. Small order available.
6. Quickly response.
7. More safe and fast transport.
About NeoDen
Factory



Exhibition






Certification

FAQ
Q1. What causes solder paste sticking to the stencil apertures?
- Aperture design: Tapered walls (e.g., laser-cut stencils) reduce adhesion.
- Paste quality: Use Type 3/4 pastes with proper viscosity (e.g., 800–1,200 kcps).
- Environment: Control humidity at 40–60% RH to prevent paste drying.
Q2. What causes poor print definition (smearing/skipping)?
A: Insufficient squeegee pressure (adjust to 4-6kg force).
Worn squeegee blades (replace every 50,000-80,000 prints).
Improper stencil-PCB separation speed (0.1-0.5mm/sec).
Contaminated stencil underside (clean every 10-15 prints).
Q3. Why does solder paste height vary across the PCB?
- Uneven stencil tension (should be >35N/cm²).
- PCB support pins improperly positioned (use 1 pin per 100cm²).
- Squeegee blade angle deviation (maintain 60±5°).
- Solder paste slump (keep paste temperature <26°C).
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