Description of NeoDen IN6
- NeoDen IN6 provides effective reflow soldering for PCB manufacturers.
- The table-top design of the product makes it a perfect solution for production lines with versatile requirements. It is designed with internal automation that helps operators provide streamlined soldering.
- NeoDen IN6 has bypassed the need for a tubular heater, which provides even temperature distribution throughout the reflow oven. By soldering PCBs in even convection, all components are heated at the same rate.
- Temperature can be controlled with extreme accuracy-users can pinpoint heat within 0.2°C.
- An internal temperature sensor ensures full control of the heating chamber and can reach optimal temperatures in as little as fifteen minutes.
- The design implements an aluminum alloy heating plate that increases the energy-efficiency of the system. The internal smoke filtering system improves the product's performance and reduces harmful output, too.
- Working files are storable within the oven, and both Celsius and Fahrenheit formats are available to users. The oven uses a 110/220V AC power source and has a gross weight of 57kg.
NeoDen IN6 parameters
Power requirements: 110/220VAC 1-phase
Rated power max.: 2000 Watts
Heating zone quantity: upper3/down3
2 pre-heat and 1 reflow zone.
Heating type: nichrome wire and aluminum alloy heating
Cooling zone quantity: 1
Conveyor speed: 15 - 60 cm/min (6 – 23 inch/min)
Up to 300ºC for lead free soldering.
Standard Max Height: 30mm
PCB temperature distribution deviation: ±1℃
Soldering width: 260 mm (10 inch)
Length process chamber: 680 mm (26.8 inch)
Heat-up time: approx. 15 min.
Dimensions: 1020 x 507 x 350 mm (L x W x H)
FAQ
Q1. What is the difference between IN6 and IN12?
- IN12: more heating zones, industrial-scale production
- IN6: compact, cost-effective, ideal for small batch
Q2. IN6 vs infrared reflow oven: which is better?
IN6 advantages:
- More uniform heating
- Reduced shadow effect
- Better solder consistency
Q3. Is IN6 better than DIY reflow ovens?
Yes:
- Industrial-grade temperature control
- Higher safety
- More stable performance
Q4. How does IN6 perform with large thermal mass PCBs?
Stable performance, but requires longer heating time and slower conveyor speed.
Q5. Why is soldering incomplete or cold joints occurring?
- Temperature too low
- Insufficient heating time
Q6. What causes tombstoning during reflow?
- Uneven heating
- Imbalanced solder paste
- PCB design asymmetry
Q7. What is the ROI of using IN6?
- Reduces outsourcing costs
- Speeds up prototyping
- Typically pays back within months (depending on usage)
Q8. Does IN6 require operator training?
Basic training is recommended, but the system is user-friendly.
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