Highlight and details
Ultimate High-Speed and High-Precision Performance
The equipment employs advanced drive and optical technologies to ensure rapid, stable, and precise inspection:
- Ultra-high positioning accuracy: XY-axis positioning accuracy ≤8μm ensures precise inspection positioning.
- High-Speed Motion System: Utilizes AC servo motors and precision-ground ball screws, achieving maximum travel speeds of 830mm/s.
- Ultra-Fast Image Processing: Image processing time for 0402 chips is less than 12ms.
- Minuscule Component Detection: Capable of detecting components as small as 01005 chips and 0.3-pitch ICs, meeting inspection demands for high-density and miniaturized PCBs.
Optical system
- Camera: 5 million pix full color high speed industrial digital camera, 20 million pix camera optional.
- Lens resolution: 10um/15um/18um/20um/25um, can be custom-made.
- Lighting source Annular stereo multi-channel color light, RGB/RGBW/RGBR/RWBR optional.
- Minimum component: 0201 chip, 0.3 pitch IC.
NeoDen ND800 parameters
PCB Thickness: 0.3mm~5mm
Max. PCB Size (X x Y): 400mm x 360mm
Min. PCB Size (Y x X): 50mm x 50mm
Max. Bottom Gap: 75mm
Max. Top Gap: 35mm
Moving speed: 830mm/Sec(Max)
Transmission height from the ground: 900±20mm
Air pressure: 0.4 – 0.8MPa
PCB bending: ＜5mm or 3% of PCB Diagonal length
Power: AC220V,50/60Hz,1.5KW
Machine dimension: 980mm * 980mm * 1620mm
About NeoDen
Factory
FAQ
Q1. What is your shipping service?
We can provide services for vessel booking, goods consolidation, customs declaration, shipping documents preparation and delivery bulk at the shipping port.
Q2. Can we visit your factory before place the order?
Yes, very welcome that must be nice to set up good relationship for business.
Q3. Can l visit your factory?
By all means, we warmly welcome your arrival.
Before you take off from your country, please let us know.
We will show you the way and arrange time to pick you up if possible.
Placement position of AOI
AOI can be arranged at multiple positions of the production line. For its main purposes, three positions are common:
① AOI inspection is arranged after solder paste printing: the AOI inspection is arranged after the solder paste printing, which is a typical arrangement because many defects are caused by poor solder paste printing. Insufficient solder paste may lead to component loss or open circuit.
② Before reflow soldering, the inspection equipment should be placed behind the chip for inspecting the defects caused by the defects of the chip.
③ After reflow soldering, the inspection equipment is placed after reflow soldering, which is the most common AOI placement position. It can inspect the defective products in all previous processes to ensure that the final defective products are not used by customers.
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