Functional Description of Key Modules of ND450
1. Electric + Air-Suspension Squeegee Head
Through innovative electrical control and pneumatic circuit designs, the squeegee pressure is continuously monitored, ensuring its stability throughout the printing process.
2. High-Precision Stencil Fixing Bracket
All crossbeams are CNC-machined to ensure precision.
The guide rails on the left and right crossbeams utilize high-precision linear guides, ensuring zero front-to-back backlash once locked.
Both the stencil and the stencil frame are secured using dual-action pneumatic cylinders, guaranteeing both convenience and reliability.
3. 3-Axis PCB Adjustment Platform
Features an integrated 3-axis module design, ensuring stability and consistency.
Incorporates a specialized lead screw and nut backlash elimination mechanism to guarantee the precision of PCB position correction.
4. Stencil Underside Cleaning Module
Utilizes a cleaning paper feed-and-feedback system paired with a high-torque geared motor to ensure the stability and consistency of every paper feed cycle.
The cleaning paper holder features a flexible lifting mechanism which, combined with a high-speed blower generating negative pressure, enables a more thorough cleaning of the stencil.
NeoDen ND450 Parameter
Machine Dimension: 992x1305x1430 mm
Machine Weight: 350 kg
Maximum frame Size: 550x650 mm
Minimum frame Size: 400x300 mm
Maximum PCB Size: 450x350 mm
Minimum PCB Size: 50x50 mm
PCB Thickness: 0.4-4 mmScraper height 65±1mm
Scraper blade thickness: 0.25mm Stainless steel squeegee blade
Printing mode: Single or double scraper printing
Printing pressure: 0.5kg - 10Kg
Printing stroke: 420mm
Field of view: 10mm * 10mm
Platform adjustment range: X:±5mm,Y:±5mm,θ:±2.8°
Benchmark point type / Base point type Standard shape fiducial mark
Product changeover: ＜5min
Operating system: Linux
About NeoDen
Factory
FAQ
Q1. How does the ND450 ensure printing alignment accuracy?
A. The equipment is equipped with a high-resolution Up/Down Vision System.
Before printing, the camera automatically scans the Mark points on both the PCB and the Stencil for calibration, ensuring the solder paste is accurately covered in the center of the pads.
Q2. How does the Automatic Cleaning System work?
A. The ND450 provides three cleaning modes: Dry, Wet, and Vacuum. Users can freely set the Cleaning Count and Cleaning Mode in the software according to the production variety. Vacuum cleaning effectively removes residual solder paste from the stencil apertures to prevent printing defects caused by clogging.
Q3. What solutions does the ND450 have for thin or warped PCBs?
A. The ND450 provides various Support Methods, including Magnetic Thimbles, Lift Platforms (Thimble Platform), and Equal-height blocks. Meanwhile, the PCB Clamp system can handle board warpage of less than 1%, ensuring a level printing surface.
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