Highlight and details
NeoDen ND800 comprehensively detects all types of defects that may occur during SMT and DIP production, ensuring complete PCB quality:
Inspection Items:
- Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc.
- Component defect: missing or excessive component, misalignment, uneven, edging, opposite mounting, wrong or bad component etc.
- DIP: Missing parts, damage parts, offset, skew, inversion, etc
- Soldering defect: excessive or missing solder, empty soldering, bridging, solder ball, IC NG ,copper stain etc.
Optical system:
- Camera: 5 million pix full color high speed industrial digital camera, 20 million pix camera optional.
- Lens resolution: 10um/15um/18um/20um/25um, can be custom-made.
- Lighting source Annular stereo multi-channel color light, RGB/RGBW/RGBR/RWBR optional.
- Minimum component: 0201 chip, 0.3 pitch IC.
NeoDen ND800 parameters
PCB Thickness: 0.3mm~5mm
Max. PCB Size (X x Y): 400mm x 360mm
Min. PCB Size (Y x X): 50mm x 50mm
Max. Bottom Gap: 75mm
Max. Top Gap: 35mm
Moving speed: 830mm/Sec(Max)
Transmission height from the ground: 900±20mm
Air pressure: 0.4 – 0.8MPa
PCB bending: ＜5mm or 3% of PCB Diagonal length
Power: AC220V,50/60Hz,1.5KW
Machine dimension: 980mm * 980mm * 1620mm
About NeoDen
Factory
FAQ
Q1. When can I get the quotation?
We usually quote within 8 hours after we get your inquiry. If you are very urgent to get the price, please tell us so that we will regard your inquiry priority.
Q2. What about the lead time for mass production?
15-30 working days for mass production.It depends on your quantity,and we will try our best to meet your needs.
Q3. What is your advantage compared with your competitors?
(1). Qualified Manufacturer
(2). Reliable Quality Control
(3). Competitive Price
(4). High Efficiency working (24*7hours)
(5). One-Stop Service
Placement position of AOI
AOI can be arranged at multiple positions of the production line. For its main purposes, three positions are common:
① AOI inspection is arranged after solder paste printing: the AOI inspection is arranged after the solder paste printing, which is a typical arrangement because many defects are caused by poor solder paste printing. Insufficient solder paste may lead to component loss or open circuit.
② Before reflow soldering, the inspection equipment should be placed behind the chip for inspecting the defects caused by the defects of the chip.
③ After reflow soldering, the inspection equipment is placed after reflow soldering, which is the most common AOI placement position. It can inspect the defective products in all previous processes to ensure that the final defective products are not used by customers.
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