Description of NeoDen S1 SMT SPI Machine
High-Resolution Imaging with Exceptional Detection Stability
5MP HD Camera: Utilizes a 5-megapixel industrial camera paired with a surround RGB light source to ensure clear, shadow-free solder paste images, laying the foundation for precise measurements.
Micron-Level Measurement Capability:
The S1 features advanced image processing, delivering height measurement accuracy of 1 μm.
Reliable Repeatability:
With repeatability and reproducibility (R&R) metrics below 10% for critical parameters like area, volume, and height, it ensures long-term production reliability.
Rapid and Efficient Solder Paste Defect Analysis
Comprehensive 2D Inspection: Efficiently detects solder paste area, offset, shape, and continuous tin electrodeposit, rapidly identifying defects like insufficient solder, excess solder, misalignment, or bridging.
Ultra-Fast Processing Speed: Powerful image algorithms achieve single-frame processing under 0.7 seconds, meeting the cycle time demands of high-speed SMT production lines.
NeoDen S1 SPI Parameter
FOV: 48mm*40mm (20 μm)
Processing time per frame: <0.7s
Max test height: 400 μm
Solder scope: 0.2mm×0.2mm~12mm×12mm
Height detection precision: 1 μm
Repeatedly (volume, area, height): <1 μm
External sizes: L1090*W1290*H1534mm
Weight: 750KG
Pcb transfer system: 900±30mm
Min pcb size: 50mm×50mm
Max pcb size: 500mm×460mm
PCB thickness: 0.6mm~6mm
Transfer speed: 1500mm/s(MAX)
Our Service
1. More Professional service in PNP machine field.
2. Better manufacture ability.
3. Various payment term to choose: T/T, Western Union, L/C, Paypal.
4. High quality/Safe material/Competitive price.
5. Small order available.
6. Quickly response.
7. More safe and fast transport.
About NeoDen
Factory
Exhibition
Certification
FAQ
Q1. What is an SPI machine, and what does it do?
Automated systems using cameras (2D/3D) to measure solder paste volume, area, height, alignment, and defects on PCBs before component placement.
Q2. Why is SPI necessary? Can't we just rely on AOI?
Catches defects at the earliest stage (paste printing), preventing costly rework later.
AOI inspects placed components/soldered joints after reflow.
SPI prevents defects AOI finds.
Q3. What defects can SPI detect?
Insufficient/excess paste, bridging, misalignment (offset), skewed paste, scooping, missing paste, pad contamination, aperture clogging, height variations.
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