NeoDen S1 Overview
Brand and Model: NeoDen S1
Application Areas: Widely used in all electronic manufacturing sectors requiring high-precision solder paste printing quality control, including consumer electronics, automotive electronics, medical devices, industrial control systems, and communication equipment.
Core Advantages: Achieves stable, efficient, and highly reliable quality control in SMT solder paste printing processes through integrated high-resolution 5MP imaging, micron-level detection accuracy (1 μm), and ultra-fast processing capability under 0.7 seconds.
Highlight And Details
High-Resolution Imaging with Exceptional Detection Stability
- 5MP HD Camera: Utilizes a 5-megapixel industrial camera paired with a surround RGB light source to ensure clear, shadow-free solder paste images, laying the foundation for precise measurements.
- Micron-Level Measurement Capability: The S1 features advanced image processing, delivering height measurement accuracy of 1 μm.
- Reliable Repeatability: With repeatability and reproducibility (R&R) metrics below 10% for critical parameters like area, volume, and height, it ensures long-term production reliability.
Rapid and Efficient Solder Paste Defect Analysis
- Comprehensive 2D Inspection: Efficiently detects solder paste area, offset, shape, and continuous tin electrodeposit, rapidly identifying defects like insufficient solder, excess solder, misalignment, or bridging.
- Ultra-Fast Processing Speed: Powerful image algorithms achieve single-frame processing under 0.7 seconds, meeting the cycle time demands of high-speed SMT production lines.
Intelligent Software System & Simplified Programming
- Quick Programming Mode: Supports automatic programming via Gerber and CAD data import, while offering offline and manual programming options to significantly streamline setup.
- User-Friendly Interface: Features a graphical user interface with one-click switching between Chinese and English systems, ensuring intuitive operation and easy mastery.
Professional SPC Real-Time Data Tracking & Analysis
- Comprehensive SPC Support: Enables offline SPC analysis and provides real-time reports for monitoring production trends of critical parameters like volume, area, height, and offset.
- Data Traceability: Inspection data and control charts can be easily exported to Excel or JPG/BMP image formats for quality traceability, process improvement, and customer reporting.
High-Speed, Stable Automated Mechanical Platform
- High-Performance Servo Drive: X/Y platforms are driven by high-performance AC servo motor systems, ensuring motion precision and stability with a maximum travel speed of 600mm/s.
- Fully Automated Transfer: Features an automatic board loading/unloading system compliant with SMEMA standard protocols, enabling seamless integration into any SMT automated production
NeoDen S1 SPI Parameter
| Check System | Camera: 5 mega-pixel |
| Lighting: Surrounded RGB | |
| FOV: 42 × 34mm (17 μm) | |
| Processing time per frame: < 0.7 seconds | |
| Max test height: 450 μm | |
| Solder scope: 0.2 ×0.2 mm ～ 12 × 12 mm | |
| Performance Metrics | Height detection precision: 1 μm |
| Volume/Area/Height Repeatability: < 1 μm @3sigma | |
| Repeatability & Reproducibility (R&R): < 10% | |
| Software Features | Operating System: Windows 10 64-bit |
| Operating Interface: Graphical programming, Chinese/English language switching | |
| Programming Support: Supports Gerber, CAD input, offline and manual programming | |
| SPC Support: Offline SPC / Real-time reporting (Anytime Report) | |
| Data Export: Excel, Images (jpg, bmp) | |
| Mechanical & Transfer | PCB Transfer Height: 900 ± 30 mm |
| Substrate Fixing Mode: Edge Lock Plate | |
| Min PCB Size: 50 × 50 mm | |
| Max PCB Size: 500 × 460 mm | |
| Transfer Speed: 1500 mm/s (Max) | |
| Platform System | Driver Equipment: AC servo motor system |
| X/Y Platform Setting Accuracy: 5μm | |
| Moving Speed: 600 mm/s |
Commercial Information
MOQ: 1 pc
Packaging Details: Wooden crate packaging
Delivery Time: 3-7 Days
About NeoDen
Factory
Quick facts about NeoDen
- Established in 2010, 200+ employees, 27,000+ Sq.m. factory.
- NeoDen provide one-stop SMT line.
- Successful 10000+ customers across the globe.
- 40+ Global Agents covered in Asia, Europe, America, Oceania and Africa.
- R&D Center: 3 R&D departments with 25+ professional R&D engineers.
- Listed with CE and got 70+ patents.
- 30+ quality control and technical support engineers, 15+ senior international sales, timely customer responding within 8 hours, professional solutions providing within 24 hours.
Exhibition
Certification
FAQ
Q: Why is SPI necessary? Can't we just rely on AOI?
A: Catches defects at the earliest stage (paste printing), preventing costly rework later.
AOI inspects placed components/soldered joints after reflow.
SPI prevents defects AOI finds.
Q: What defects can SPI detect?
A: Insufficient/excess paste, bridging, misalignment (offset), skewed paste, scooping, missing paste, pad contamination, aperture clogging, height variations.
Q: What's the difference between 2D SPI and 3D SPI? Which is better?
A: 2D measures area/alignment, 3D measures volume, height, and shape precisely.
3D is the industry standard for modern SMT lines due to critical volume measurement.
Q: What are the key benefits of using SPI?
A: Reduced defects/scrap/rework, improved first-pass yield, lower overall cost, process optimization data, printer feedback, SPC capability.
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