NeoDen ND722R BGA Reflow Station

Brand and Model: NeoDen ND722R

Application Areas: Suitable for SMT manufacturing, electronic product repair, and rework applications. Specializes in remove, alignment, and soldering tasks for various packaged chips including BGA, CBGA, CCGA, and CSP.

Core Advantages: Achieves high efficiency, high yield, and high automation in complex BGA chip rework processes through three-zone independent precision temperature control, a high-definition optical alignment system, and fully automated remove functionality.

Highlight and details

 

High-Efficiency, Precise Triple-Zone Heating System

• Independent Temperature Control for Three Zones: Features top hot air, bottom hot air, and a third zone (large-area bottom infrared IR) with independent heating capabilities, enabling precise segmented temperature control.
• Large-Area Infrared Preheating: The third zone employs a large-area infrared carbon fiber preheating system, delivering rapid and uniform heating without light pollution, effectively preventing PCB warping.
• Up to Ten Temperature Control Curves: Supports configuring up to ten temperature control processes to meet all types of BGA rework requirements.
• High-Precision Real-Time Temperature Control: Utilizes K-type thermocouple closed-loop control with temperature accuracy up to ±3°C. The touchscreen displays three real-time temperature curve graphs, with temperature deviation controllable within 1°C.
• One-Click Temperature Curve Recall: Supports unlimited storage of temperature profiles for instant retrieval and use, significantly streamlining operation.

Optical Alignment & High-Precision Motion Control

• Optical Alignment System: Utilizes an optical alignment system and CCD monitor to ensure precise BGA-to-PCB alignment with simple, convenient operation.

 

• Precision Micro-Adjustment & Positioning: Linear guide rail design enables high-precision micro-adjustment or rapid positioning along X, Y, and Z axes.

 

• Laser Rapid Positioning: Equipped with laser positioning (red dot indicator) to assist in quickly determining rework locations.

 

• V-Groove Flexible Fixture: Utilizes V-groove with flexible fixtures to position PCBs, effectively securing and protecting them.

Intelligent Automation and Safety Assurance

• Fully Automated Operation: Achieves automatic remove and soldering of BGA chips without manual adjustments.
• PC Control and Data Analysis: Supports computer connectivity (USB interface, driver-free installation) for convenient temperature curve setup, display, saving, and printing.
• High-Precision Temperature Testing: Utilizes three K-type sensors for high-accuracy temperature measurement at various points on PCBs or BGAs, with automatic generation of curve analysis reports by the PC.
• Adjustable Hot Air Flow: Airflow volume can be customized for different chip requirements.
• Rapid Cooling System: Equipped with a powerful cross-flow fan for swift PCB cooling, preventing thermal deformation.
• Multi-Layer Safety Protection: Features over-temperature protection, with temperature parameters secured by permission controls to prevent incorrect settings.

MOQ: 1 pc

Packaging Details: Wooden crate packaging

Delivery Time: 3-7 Days

About NeoDen

Quick facts about NeoDen

• Established in 2010, 200+ employees, 27,000+ Sq.m. factory.
• NeoDen provide one-stop SMT line.
• Successful 10000+ customers across the globe.
• 40+ Global Agents covered in Asia, Europe, America, Oceania and Africa.
• R&D Center: 3 R&D departments with 25+ professional R&D engineers.
• Listed with CE and got 70+ patents.
• 30+ quality control and technical support engineers, 15+ senior international sales, timely customer responding within 8 hours, professional solutions providing within 24 hours.

Hot Tags: NeoDen ND722R BGA Reflow Station, China NeoDen ND722R BGA Reflow Station manufacturers, suppliers, factory, bga repair station, bga rework machine, infrared bga rework station, infrared rework station, automatic bga rework station, BGA Reflow Station