How To Perform First-Board Trial Assembly And Program Verification On NeoDen N10P?

Introduction

In SMT small-batch production, prototype prototyping, or R&D validation phases, first-board trial assembly is a critical step to ensure the yield rate of the entire PCB batch.

This guide provides step-by-step instructions on how to perform standardized and efficient first-board trial assembly and program verification on the NeoDen N10P. It helps you avoid placement errors from the outset, ensures flawless program execution, and lays a solid foundation for subsequent mass production.

Why is First-Board Verification So Critical?

In electronics manufacturing, "the first piece sets the standard."

The objectives of first-board trial assembly are:

• Verify the placement position, angle, and polarity of every component in the program.
• Confirm pick-and-place stability to prevent frequent component rejection or failure to pick.
• Calibrate the accuracy of the visual recognition system (Flying Camera/Mark/IC Camera).
• Optimize placement paths and efficiency to establish a stable baseline for subsequent production.

NeoDen N10P simplifies this high-precision task through a modular workflow and visual debugging interface, making it straightforward and controllable.

Preparation Phase: Ensuring Equipment is in "Standard State"

The accuracy of first-board verification relies on the stability of the equipment itself. Before beginning, complete the following initialization steps:

1. Perform Equipment Initialization

• Placement Head Initialization: In the "Applications" menu, click "Placement Head Initialization" to ensure all 8 placement heads return to Z-axis zero.
• Coordinate Initialization (XY Zero Return): Click "Coordinate Initialization" to synchronize X/Y axis magnetic scales with drivers, establishing a precise coordinate system.

Note: Skipping this step will cause all coordinates to lose reference benchmarks, resulting in placement offset.

2. Perform 10-Minute Warm-Up

• In "Applications," select "Machine Warm-Up" → Click "Start."
• Warm-up allows lead screws, guide rails, and motors to reach thermal equilibrium, eliminating micron-level displacement errors from cold starts. This is especially critical for micro-components like 0402 and 0201.

3. Verify Air Pressure and Tracks

• Verify main air source pressure ≥ 0.6MPa (refer to pressure gauge on oil-water separator unit).
• Set pick-up head pressure to 0.55MPa, feeder pressure to 0.6MPa.
• Adjust track width via "Track Settings" to ensure PCB is held securely but not excessively tight (recommended width = PCB width + 1mm).

Step 1: Offline Verification of Program Logic

Before initiating actual placement, conduct a comprehensive software-level inspection to prevent "running with defects."

1. Verify Component Coordinates and Polarity

• Navigate to "File List" → Select target program → Click "Edit".
• On the "Steps" page, check critical components (e.g., electrolytic capacitors, ICs, diodes) to ensure their Angle matches PCB silkscreen markings.
• Use "Find Part Number" to quickly locate specific components and confirm their X/Y coordinates show no abnormal offset.

2. Verify Nozzle Configuration

Go to the "Components" page and confirm each package (e.g., 0402, SOT23, QFP) is matched with the correct Nozzle model (refer to Table 1-2 in the manual):

• 0402 → CN040 or CN065
• SOP8 → CN220
• Large BGAs → CN750/CN1100

Enter "Nozzle Inventory Management" to confirm the actual quantity in stock ≥ the quantity required by the program, preventing interruptions during processing due to nozzle shortages.

3. Feeder Material Configuration Test

• On the "Feeder" page, verify that the package/specification of each material stack matches the material installed on the feeder.
• Use the "Manual Test → Feeder" function to individually trigger feeding from each feeder, observing smoothness and complete stripping.
• For tray components, verify that the coordinates for the "lower left corner" and "upper right corner" of the tray have been calibrated and locked via the Mark camera.

Step Two: Dry Run Simulation Testing

This golden step verifies program safety by simulating placement paths without picking or placing components.

Procedure

• Enter the "File Processing Page".
• Click "Configuration" → Check "Simulate Placement".
• Click "Start." The machine will execute the program path while skipping pick-and-place actions.

Key Observations:

• Does the placement head's trajectory precisely align with each pad center?
• Are there interference risks? Could the placement head collide with tall components (e.g., heat sinks, connectors) or fixtures on the PCB?
• Mark point recognition speed and accuracy: Can the device quickly lock onto PCB mark points? If recognition fails, return to "PCB → Mark Information" to adjust aperture, brightness, roundness, etc.

Tip: Enable "Support Log Image Output" to automatically save images of each mark recognition for later failure analysis.

Step Three: First PCB Test Placement (Single-Step Mode Recommended)

After completing the dry run, proceed with actual placement. Strongly recommend using "Single-Step Mode" to verify each component individually.

Operational Flow

• Load the first PCB: Click "Feed PCB into Track" and ensure the PCB is securely clamped.
• Initiate Single-Step Mode: Click the "Single-Step" button on the processing page.

Component-by-Component Placement & Inspection

• Verify pick-up success (check negative pressure via "Manual Test → Pick-up → Suction").
• Confirm camera calibration accuracy (ensure complete component framing in camera images).
• Inspect placement precision for no misalignment, tombstoning, or flipping.

Common Issue Quick Fixes

First Article Inspection (FAI) & Program Optimization

Checklist

• Verify all component part numbers and specifications are correct.
• Ensure polarity components (e.g., LEDs, electrolytic capacitors) are oriented consistently.
• Verify no tombstoning, misalignment, or missing microcomponents (0201/0402).
• Confirm IC pins align with pads without bridging risks.

Program Fine-Tuning & Saving

• For overall misalignment, return to "PCB → Origin Position" and recalibrate using "Origin Adjustment".
• For individual component angle errors, directly modify the "Angle" value on the "Steps" page.
• Always click "Save" after adjustments to prevent program loss.

Pro Tip: After first-board verification, click "Export to USB" to back up the verified program for rapid deployment on other N10P devices.

Conclusion

NeoDen N10P high speed pick and place machine is not merely a high-speed pick and place machine, but a complete SMT engineering solution. From program import, vision calibration, and path optimization to first-board verification, every step is backed by 14 years of technical expertise and over 70 patents, specifically designed for R&D prototyping and medium-batch flexible production scenarios.

 

Quick facts about NeoDen

1) Established in 2010, 200 + employees, 27000+ Sq.m. factory.

2) NeoDen Products:Different Series PnP machines, NeoDen YY1, NeoDen4, NeoDen5, NeoDen K1830, NeoDen9, NeoDen N10P. Reflow Oven IN Series, as well as complete SMT Line includes all necessary SMT equipment.

3) Successful 10000+ customers across the globe.

4) 40+ Global Agents covered in Asia, Europe, America, Oceania and Africa.

5) R&D Center: 3 R&D departments with 25+ professional R&D engineers.

6) Listed with CE and got 70+ patents.

7) 30+ quality control and technical support engineers, 15+ senior international sales, for timely customer responding within 8 hours, and professional solutions providing within 24 hours.